Usually includes the following steps. The specific operation may vary slightly depending on the equipment model. Please refer to the equipment manual:

Preparation

1. Check the equipment

① Confirm that all parts of the tensile machine (clamp, handle, dial, etc.) are intact.

② Ensure that the clamp is clean and free of oil or residue to avoid affecting the test results.

2. Calibrate the equipment (first use or regular calibration)

Adjust the pointer to zero according to the manual, or use a standard weight to verify the accuracy of the reading.

3. Prepare the sample

(1) Sew the button to be tested on the standard fabric (or keep the button on the original garment), ensuring that the seam is firm.

(2) Cut the fabric and leave enough area around the button (usually ≥5cm×5cm) for clamping.

Test steps

1. Fix the sample

Upper clamp: clamp the fabric (avoid the seam) and ensure that the fabric is flat and does not slide.

Lower clamp: Clamp the button (if it is a four-hole button, it needs to be fixed with a special clamp or hook).

Note: The direction of the clamp must be consistent with the force direction of the button (such as vertical or horizontal stretching).

2. Start the test

(1) Slowly turn the handle or pull the lever to apply tension at a constant speed (usually the speed recommended is 10-15cm/min).

(2) Observe the connection between the button and the fabric until the button falls off or the stitching breaks.

3. Record data

(1) Read the maximum tension value indicated by the pointer (usually in Newtons N or pounds-force lbf).

(2) Record the damage form when the button falls off (such as stitching breakage, button fragmentation, etc.).

Post-test operation

1. Reset the equipment

(1) Loosen the clamp, remove the sample, and return the handle of the tensile machine to its original position.

(2) Clean the thread or fabric fragments remaining in the clamp.

2. Data analysis

Compare the test results with industry standards (such as ASTM D4846, ISO 13935, etc.) to determine whether the button is qualified.

Precautions

Safe operation: Avoid rapid force or overload testing to prevent the fixture from breaking and injuring people.

Environmental conditions: It is recommended to test in a standard temperature and humidity environment (such as 23±2℃, 50±5%RH).

Multiple tests: It is recommended to test the same button 3-5 times and take the average value to improve accuracy.

Common problem handling

The pointer does not return to zero: Check whether the spring or lever is stuck, and contact the manufacturer for calibration if necessary.

Button slips: Replace the fixture or use an anti-slip pad to enhance the clamping force.

If more detailed guidance is required, please provide the equipment model or refer to the specific manual.

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I. Instrument overview

The manual rubbing color fastness tester is used to evaluate the color transfer degree of textiles, leather, coated fabrics and other materials under dry or wet rubbing conditions. The equipment is easy to operate and is suitable for rapid color fastness testing in laboratories or factories. It complies with relevant standards (such as GB/T 3920, ISO 105-X12, AATCC 8, etc.).

II. Test principle

By manually operating the friction device, the standard friction cloth is rubbed back and forth on the surface of the sample with the specified pressure and number of frictions, and the color staining of the friction cloth is observed and compared with the standard grayscale sample card for rating.

III. Operation steps

1. Preparation

Sample preparation:

Cut the sample to be tested with a size of ≥20cm×5cm (adjusted according to the standard), ensuring that the surface is flat, wrinkle-free and stain-free.

Rubbing cloth cutting: Use standard bleached cotton cloth (as specified in GB/T 7568) and cut it into a 5cm×5cm square.

Wet friction test: The friction cloth needs to be soaked with distilled water, and the moisture content is controlled at 100±5% (the moisture can be controlled by wringing).

2. Install the friction cloth

Wrap the friction cloth flatly on the friction head (usually a round friction head with a diameter of 16mm) and fix it with a rubber band or a fixing clip to ensure that there is no looseness or wrinkles.

3. Fix the sample

Spread the sample to be tested flat on the test bench or flat table and fix it with a clamp to prevent movement.

4. Manual friction test

Dry friction test:

1. Press the friction head wrapped with the friction cloth vertically on the surface of the sample.

2. Apply standard pressure (usually 9N or as required by the standard).

3. Rub back and forth 10 times at a uniform speed in the straight direction (one way is about 10cm, speed is about 1 time/second).

Wet friction test:

1. After the friction cloth is soaked, gently squeeze out excess water (avoid dripping).

2. Perform the test according to the dry friction steps. After the friction is completed, remove the friction cloth and dry it immediately.

5. Result evaluation

After the friction cloth is dry (wet friction needs to be dried naturally), compare it with the standard staining gray scale sample card (such as ISO 105-A03) and evaluate the staining level (level 5 is the best and level 1 is the worst).

Record the test results of dry friction and wet friction, and use the lower level as the final evaluation.

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Direct: + 86 152 6060 5085

Tel: +86-596-7686689

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Dear customers:

Hello!

On the occasion of May Day, thank you for your trust and support for our company. According to the national statutory holidays and the actual situation of our company, the holiday time and service arrangements are hereby notified as follows:

Our holiday time:

May 1, 2025 (Thursday) to May 5 (Monday), a total of 5 days.

April 27 (Sunday) and May 10 (Saturday) will be normal work.

Service arrangements:

1. During the holiday, our company will suspend logistics delivery (if you need urgent assistance, please contact the duty phone: 0596-7686689).

Thank you again for your understanding and support! I wish you a happy holiday and a healthy family!

UTS International Co., Ltd.

April 25, 2025

1. Product Overview

Single yarn strength refers to the maximum force that a single yarn can withstand when it is stretched and broken, and is one of the important indicators for measuring yarn quality. This product is suitable for testing and evaluating yarn strength in the textile industry.

2. Scope of application

1. Strength test of various types of yarns such as cotton yarn, wool yarn, and chemical fiber yarn

2. Quality control of textile production enterprises

3. Acceptance standards for yarn procurement

4. Material performance research of scientific research institutions

3. Technical parameters

1. Test range: 0-5000cN

2. Accuracy: ±1%

3. Clamping distance: 100mm, 250mm, 500mm (adjustable)

4. Stretching speed: 50-500mm/min (adjustable)

5. Test environment: temperature 20±2℃, relative humidity 65±3%

4. Operation steps

4.1 Preparation

1. Place the instrument on a stable workbench

2. Connect the power supply and preheat for 15 minutes

3. Set the appropriate clamping distance and stretching speed according to the yarn type

4. Prepare the yarn sample to be tested to ensure that it is not damaged and has no knots

4.2 Test process

1. Clamp the yarn sample vertically in the upper and lower clamps

2. Ensure that the yarn is not loose and is perpendicular to the fixture

3. Start the test program

4. The instrument automatically records the breaking strength value

5. Repeat the test at least 20 times to obtain reliable data

4.3 Data processing

1. Calculate the average single yarn strength

2. Calculate the strength unevenness

3. Record the maximum and minimum values

4. Generate a test report

5. Notes

1. The instrument should be calibrated before testing

2. Different types of yarn should use corresponding test parameters

3. Avoid the fixture from clamping the yarn and affecting the test results

4. The temperature and humidity of the test environment should meet the standard requirements

5. Clean the fixture surface regularly to maintain the test accuracy

6. Maintenance

1. Perform a full calibration once a month.

2. Clean the instrument surface after each use.

3. Check the sensor sensitivity regularly.

4. When not in use for a long time, the power should be turned off and covered to prevent dust.

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AEC-Q200 Passive Component Stress Test Certification Specification for Automotive Industry

    In recent years, with the progress of multi-functional in-vehicle applications, and in the process of popularization of hybrid vehicles and electric vehicles, new uses led by power monitoring functions are also expanding, miniaturization of vehicle parts and high reliability requirements under high temperature environmental conditions (-40 ~ +125℃, -55℃ ~ +175℃) are increasing. A car is composed of many parts. Though these parts are large and small, they are closely related to the life safety of car driving, so every part is required to achieve the highest quality and reliability, even the ideal state of zero defects. In the automotive industry, The importance of quality control of auto parts is often over the functionality of parts, which is different from the needs of consumer electronics for the general people's livelihood, that is to say, for auto parts, the most important driving force of the product is often not [the latest technology], but [quality safety]. In order to achieve the improvement of quality requirements, it is necessary to rely on strict control procedures to check, the current automotive industry for parts qualification and quality system standards is AEC(Automotive Electronics Committee). The active parts designed for the standard [AEC-Q100]. The passive components designed for [AEC-Q200]. It regulates the product quality and reliability that must be achieved for passive parts.

Classification of passive components for automotive applications:

Automotive grade electronic components (compliant with AEC-Q200), commercial electronic components, power transmission components, safety control components, comfort components, communication components, audio components

Parts summary according to AEC-Q200 standard:

Quartz oscillator: Application range [tire pressure monitoring systems (TPMS), navigation, anti-lock brakes (ABS), airbags and proximity sensors In-vehicle multimedia, in-vehicle entertainment systems, backup camera lenses]

Automotive thick film chip resistors: Application [automotive heating and cooling systems, air conditioning, infotainment systems, automatic navigation, lighting, door and window remote control devices]

Automotive sandwich metal oxide varistors: Application [Surge protection of motor components, surge absorption of components, semiconductor overvoltage protection]

Low and high temperature surface mount solid molded chip tantalum capacitors: Application [fuel quality sensors, transmissions, throttle valves, drive control systems]

Resistance: SMD resistor, film resistor, thermistor, varistor, automotive vulcanization resistance, automotive precision film wafer resistance array, variable resistance

Capacitors: SMD capacitors, ceramic capacitors, aluminum electrolytic capacitors, film capacitors, variable capacitors

Inductance: Reinforced inductance, inductor

Other: LED thin film alumina ceramic cooling substrate, ultrasonic components, overcurrent protection SMD, overtemperature protection SMD, ceramic resonator, automotive PolyDiode semiconductor ceramic electronic protection components, network chips, transformers, network components, EMI interference suppressors, EMI interference filters, self-recovery fuses

Passive device stress test grade and minimum temperature range and typical application cases:

Note: Certification for applications in higher grade environments: Temperature grades must have a product life worst-case and application design, i.e. at least one batch of each test must be validated for applications in higher grade environments.

Number of certification tests required:

High temperature storage, high temperature working life, temperature cycle, humidity resistance, high humidity: 77 thermal shock: 30

Number of certification tests Note:

This is a destructive test and the component cannot be reused for other certification tests or production

Bellcore GR78-CORE Test Specification

Bellcore GR78-CORE is one of the specifications used in the early surface insulation resistance measurement (such as IPC-650). The relevant precautions in this test are organized for the reference of the personnel who need to carry out this test, and can also provide a preliminary understanding of this specification.

Test purpose:

Surface Insulation resistance testing

1. Constant temperature and humidity test chamber: the minimum test conditions are 35°C±2°C/85%R.H, 85 ±2°C/85%R.H.

2. Ion migration measurement system: Allowing the insulation resistance of the test circuit (pattern) to be measured under these conditions, a power supply will be able to provide 10 Vdc / 100μA.

Test procedure:

a. The object to be measured is tested after 24 hours at 23℃(73.4℉)/50%R.H. condition.

b. Place limited Test patterns on an appropriate rack and keep the test circuits at least 0.5 inches apart, keep air flow and the rack in the furnace until the end of the experiment.

c. Place the shelf in the center of the constant temperature and humidity machine, align and parallel the test board with the air flow in the chamber, and lead the line to the outside of the chamber, so that the wiring is far away from the test circuit.

d. Close the furnace door and set the condition to 35 ±2°C, at least 85%R.H. and allow the furnace to spend several hours stabilizing

e. After 4 days, the insulation resistance will be measured and the measured value will be recorded periodically between 1 and 2,2 and 3,3 and 4, 4 and 5 using an applied voltage of 45 ~ 100 Vdc. Under the test conditions, the test is sent out the measured voltage to the circuit after 1 minute. 2 and 4 are periodically at an identical potential. And 5 periodically at opposite potentials.

f. This condition only applies to transparent or translucent materials, such as solder masks and conformal coatings.

g. As for multilayer printed circuit boards required for insulation resistance testing, the only normal procedure will be used for insulation resistance testing circuit products. Extra cleaning procedures are prohibited.

Method of conformity determination:

1. After the electron migration test is completed, the test sample is removed from the test furnace, illuminated from the back and tested at 10 x magnification, and will not be found to reduce the electron migration (filamental growth) phenomenon by more than 20% between the conductors.

2. adhesives will not be used as a basis for republication when determining compliance with the 2.6.11 test method of IPC-TM-650[8] to examine appearance and surface item by item.

Reasons why insulation resistance does not meet the requirements:

1. Contaminants weld the cells like wires on the insulating surface of the substrate, or are dropped by the water of the test furnace (chamber)

2. Incompletely etched patterns will reduce the insulation distance between conductors by more than permitted design requirements

3. Chafes, breaks, or significantly damages the insulation between conductors

Burn-in is an electrical stress test that employs voltage and temperature to accelerate the electrical failure of a device. Burn-in essentially simulates the operating life of the device, since the electrical excitation applied during burn-in may mirror the worst-case bias that the device will be subjected to in the course of its use able life. Depending on the burn-in duration used, the reliability information obtained may pertain to the device's early life or its wear-out. Burn-in may be used as a reliability monitor or as a production screen to weed out potential infant mortalities from the lot.

Burn-in is usually done at 125 deg C, with electrical excitation applied to the samples. The burn-in process is facilitated by using burn-in boards (see Fig. 1) where the samples are loaded. These burn-in boards are then inserted into the burn-in oven (see Fig. 2), which supplies the necessary voltages to the samples while maintaining the oven temperature at 125 deg C. The electrical bias applied may either be static or dynamic, depending on the failure mechanism being accelerated.

JEDEC, a standardization organization in the semiconductor industry, develops industrial standards in solid state electronics (semiconductor, memory), established for more than 50 years, is a global organization. The standards it has formulated are many industries take over and adopt. It's technical data are open and free of charge, only some of the data need to be charged. So you can go to the official website to register and download, the content contains the definition of professional terms, product specifications, test methods, reliability test requirements... It covers a wide range of topics.

JEP122G-2011 Failure mechanism and model of semiconductor components

Accelerated life tests are used to identify potential semiconductor failure causes in advance and estimate possible failure rates. The relevant activation energy and acceleration factor formulas are provided in this section for estimation and failure rate statistics under accelerated life tests.

Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber, SIR Surface insulation resistance measurement system

JEP150.01-2013 Stress test drive failure mechanism associated with assembly of solid state surface mount components

GBA and LCC are attached to the PCB, using a more commonly used set of accelerated reliability tests to evaluate the heat dissipation of the production process and product, to identify potential failure mechanisms, or any reason that may cause error failure.

Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber

JESD22-A100E-2020 Cycle temperature and humidity bias surface condensation life test

Test the reliability of non-sealed solid state devices in humid environments through temperature cycling + humidity + current bias. This test specification adopts the method of [temperature cycling + humidity + current bias] to accelerate the penetration of water molecules through the external protective material (sealant) and the interface protective layer between the metal conductor. Such a test will cause condensation on the surface. It can be used to confirm the corrosion and migration phenomenon of the surface of the product to be tested.

Recommended equipment: high and low temperature test chamber

JESD22-A101D.01-2021 Steady-state temperature and humidity bias life test

This standard defines the methods and conditions for performing temperature-humidity life tests under applied bias to assess the reliability of non-airtight packaged solid-state devices (e.g., sealed IC devices) in humid environments.

High temperature and humidity conditions are used to accelerate moisture penetration through external protective materials (sealants or seals) or along the interface between external protective coatings and conductors and other through parts.

Recommended equipment: high and low temperature test chamber

JESD22-A102E-2015 package IC unbiased PCT test

To evaluate the integrity of non-airtight packaged devices against water vapor in a condensed or saturated water vapor environment, the sample is placed in a condensed, high-humidity environment under high pressure to allow water vapor to enter the package, exposing weaknesses in the package, such as delamination and metallization layer corrosion. This test is used to evaluate new package structures or updates of materials and designs in the package body. It should be noted that there will be some internal or external failure mechanisms in this test that do not match the actual application situation. Since absorbed water vapor reduces the glass transition temperature of most polymer materials, an unreal failure mode may occur when the temperature is higher than the glass transition temperature.

Recommended equipment: Highly accelerated life test chamber

JESD22-A104F-2020 Temperature cycle

The temperature cycle (TCT) test is the reliability test of the IC part subjected to extremely high temperature and extremely low temperature, back and forth temperature conversion between the test, the IC part is repeatedly exposed to these conditions, after the specified number of cycles, the process is required to specify its temperature change rate (℃/min), in addition to confirm whether the temperature is effectively penetrated into the test product.

Recommended equipment: thermal shock test chamber

JESD22-A105D-2020 Power and temperature cycle

This test is applicable to semiconductor components affected by temperature. In the process, the test power supply needs to be turned on or off under the specified high and low temperature difference conditions. The temperature cycle and power supply test are to confirm the bearing capacity of the components, and the purpose is to simulate the worst situation that will be encountered in practice.

Recommended equipment: thermal shock test chamber

JESD22-A106B.01-2016 Temperature shock

This temperature shock test is carried out to determine the resistance and impact of semiconductor components to sudden exposure to extreme high and low temperature conditions. The temperature change rate of this test is too fast to simulate the real actual use. The purpose is to apply more severe stress on semiconductor components, accelerate the damage of their vulnerable points, and find out the possible potential damage.

Recommended equipment: thermal shock test chamber

JESD22-A110E-2015 HAST highly accelerated life test with bias

According to JESD22-A110 specifications, both THB and BHAST are used to test components at high temperature and humidity, and the test process needs to be biased to accelerate the corrosion of components. The difference between BHAST and THB is that they can effectively shorten the test time required for the original THB test

Recommended equipment: Highly accelerated life test chamber

JESD22A113I plastic surface mount device prior to reliability testing

For non-enclosed SMD parts, pre-treatment can simulate the reliability problems that may occur during the assembly of the circuit board due to the damage caused by packaging moisture, and identify potential defects in the reflow assembly of SMD and PCB through the test conditions of this specification.

Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber

JESD22-A118B-2015 Unbiased high-speed accelerated life test

To evaluate the resistance of non-airtight package components to moisture under non-biased conditions, confirm their moisture resistance, robustness and accelerated corrosion and aging, which can be used as a test similar to JESD22-A101 but at a higher temperature. This test is a highly accelerated life test using non-condensation temperature and humidity conditions. This test must be able to control the rising and cooling rate in the pressure cooker and the humidity during cooling

Recommended equipment: Highly accelerated life test chamber

JESD22-A119A-2015 Low temperature storage life test

In the case of no bias, by simulating the low temperature environment to assess the ability of the product to withstand and resist low temperature for a long time, the test process does not apply bias, and the electrical test can be carried out after the test is returned to normal temperature

Recommended equipment: high and low temperature test chamber

JESD22-A122A-2016 Power cycle test

Provides standards and methods for solid-state component package power cycle testing, through biased switching cycles that cause uneven temperature distribution inside the package (PCB, connector, radiator), and simulates standby sleep mode and full load operation, as well as life cycle testing for associated links in solid-state component packages, This test complements and augments the results of the JESD22-A104 or JESD22-A105 tests, which cannot simulate harsh environments such as engine rooms or aircraft and space shuttles.

Recommended equipment: thermal shock test chamber

JESD94B-2015 Application-Specific qualifications use knowledge-based testing methods

Testing devices with correlated reliability testing techniques provides a scalable approach to other failure mechanisms and test environments, and life estimates using correlated life models

Recommended equipment: high and low temperature test chamber, hot and cold shock test chamber, highly accelerated life test chamber

LED Street Lamp Test Specification

    LED street lights are currently one of the key implementation methods to save energy and reduce carbon, all countries in the world have been in full swing to replace the original traditional street lights with LED street lights, and the new street is directly limited to the use of LED street lights to save energy. At present, the world LED street lamp market size of about 80 million, LED lamp light source whether it is heat, service life, output spectrum, output illuminance, material characteristics, are different from traditional mercury lamp or high-pressure sodium lamp. The test conditions and test methods of LED street lights are different from traditional lamps. Lab Companion collected the reliability test methods related to LED street lights at present and provide you with reference to help you understanding the related tests about LED.

LED street lamp test specification abbreviation:

LED street lamp test standard specification, LED street lamp test method technical specification, LED street lamp standard and test method, night landscape engineering semiconductor lighting device components product technical specification, semiconductor lighting night landscape engineering construction quality acceptance technical specification, IEC 61347LED power supply safety regulation

LED street lamp test specification conditions:

CJJ45-2006 Urban road lighting design standard, UL1598 lamps safety standard, UL48 wire and cable safety standard, UL8750 light-emitting diode safety standard, CNS13089 light-emitting diode large lamp durability Test - pre-burning test - outdoor, Waterproof Test: IP65, American Standard for LED lamps, EN 60598-1, EN 60598-2 Street lamp test

LED large lamp quality certification test project:

Temperature cycle, temperature and humidity cycle, high temperature preservation, moisture resistance, vibration, shock, continuous power, salt water spray, acceleration, solder heat resistance, solder adhesion, terminal strength, natural drop, dust test

LED large lamp quality certification test conditions:

Temperature cycle: 125℃(30min)←R.T.(5min)→-65℃(30min)/5cycle

LED street lamp (light-emitting diode outdoor display with large lights) failure determination:

a. The axis light is lower than the residual rating of 50%

b. Forward voltage is greater than 20% of the rated value

c. Reverse current greater than 100% of the rated value

d. The half height wave length and half power Angle of the light exceed the limited maximum value or the limited minimum value meet the above conditions, and determine the failure of the LED street lamp

Note: The luminous efficiency of LED street lamp is recommended to be at least 45lm/W or above (the luminous efficiency of LED light source must be about 70 ~ 80lm/W)

High temperature storage: maximum storage temperature 1000 hours [special level 3000 hours]

Moisture resistance: 60℃/90%R.H./1000 hours [characteristic level 2000 hours]/ applying bias

Brine spray: 35℃/ concentration 5%/18 hours [24 hours special level]

Continuous power: maximum forward current 1000 hours

Natural fall: Fall height 75cm/ fall times 3 times/fall material smooth maple wood

Dust test: continuous 360 hours of 50℃ ring temperature test

Vibration: 100 ~ 2000Hz, 196m/s^2, 48 hours

Impact: Grade F[Acceleration 14700m/s^2, pulse amplitude 0.5ms, six directions, three times in each direction]

Equal acceleration: Acceleration is applied in all directions (class D: 196000 m/s^2) for 1 minute

Solder heat resistance: 260℃/10 seconds /1 time

Solder adhesion: 250℃/5 seconds

Terminal strength

LED large lamp batch quality test project:

Terminal strength, solder heat resistance, temperature cycle, moisture resistance, continuous power, high temperature storage

LED large lamp batch quality test conditions:

Moisture resistance: 60℃/90%R.H./168 hours (no failure)/500 hours (one failure allowed)[test number 10 / apply bias]

Continuous power on: maximum forward current /168 hours (no failure)/500 hours (one failure allowed)[test number 10]

High temperature storage: maximum storage temperature /168 hours (no failure)500 hours (one failure allowed)[test number 10]

Solder heat resistance: 260℃/10 seconds /1 time

Solder adhesion: 250℃/5 seconds

LED large lamp regular quality test project:

Vibration, shock, acceleration, moisture resistance, continuous power, high temperature preservation

Regular quality test conditions for LED large lights:

Moisture resistance: 60℃/90%R.H./1000 hours

Continuous power: maximum forward current /1000 hours

High temperature storage: Maximum storage temperature /1000 hours

Vibration: 100 ~ 2000Hz, 196m/s^2, 48 hours

Impact: Grade F[Acceleration 14700m/s^2, pulse amplitude 0.5ms, six directions, three times in each direction]

Equal acceleration: Acceleration is applied in all directions (class D: 196000 m/s^2) for 1 minute

LED large lamp screening test project:

Acceleration test, temperature cycle, high temperature preservation, pre-burning test

LED large light screening test conditions:

Constant acceleration test: Apply acceleration (grade D: 196000 m/s^2) in each direction for 1 minute

Temperature cycle: 85℃(30min)←R.T.(5min)→-40℃(30min)/5cycle

Pre-firing test: temperature (maximum rated temperature)/ current (maximum rated forward current)96 hours

High temperature storage: 85℃/72 ~ 1000 hours

LED lamp life test:

More than 1000 hours of Life Test (Life Test), light attenuation < 3% [withered light]

More than 15,000 hours of Life Test (Life Test), light attenuation < 8%

Specification for Ground Solar Radiation Simulation Test

    The purpose of this test method is to determine the physical and chemical effects of components and equipment exposed to solar radiation on the Earth surface (e.g. The main characteristics of the simulated environment in this experiment are the solar spectral energy distribution and intensity of received energy under the control of temperature and humidity in the test environment. There are three procedures in the test mode (Procedure A: thermal effect evaluation, procedure B: degradation effect evaluation, procedure C: photochemical effect evaluation).

Applicable products:

Electronic products that will be used outside the home for a long time, such as: laptops, mobile phones, MP3&MP4, GPS, automotive electronics, digital cameras, PDAs, low-cost laptops, easy to carry laptops, video cameras, Bluebud headphones

Test requirements:

1. Spectral energy distribution shall meet the requirements of the specification

2. Illuminance: 1.120KW/m^2 (±10%)=[300-400um, 63 w/m2][The total global radiation of the earth's surface from the sun and the sky vertical is 1.120KW/m^2]

3. Temperature and humidity 40℃(±2)/93%(±3)R.H.

4. This test needs to control the humidity environment

5. During irradiation, the temperature in the box rises to the specified temperature (40℃, 55℃) at a linear rate.

6. The temperature in the box should start to rise 2 hours before irradiation

7. The temperature in the dark chamber should be decreased linearly and maintained at 25℃

8. Temperature error: ±2℃

9. The temperature measurement point in the box is taken from the test distance of 1m from the specimen or half of the box wall distance (the smaller one)

Spectral energy distribution and tolerance error range of Xenon lamp (according to the requirements of the International Illuminance Commission CIE)

The xenon lamp weather testing machine is not lit, but the spectrum output by its xenon lamp must be output in accordance with the requirements of the International Illuminance Commission CIE. Therefore, the equipment manufacturer of the weather testing machine must have the equipment (spectrometer) and technical capability to verify the xenon lamp spectrum (provide xenon lamp verification report).

Test procedure evaluation description:

According to IEC68-2-5&IEC-68-2-9, there are three kinds of test methods for light resistance test, which can be divided into program A: thermal effect, B: degradation effect, C: photochemistry. Among these three methods, procedure A is the most severe test method, which will be detailed in the following article.

Three test procedures: Procedure A: thermal effect (most severe natural conditions), B: degradation effect (22.4KWh/m2 per day), C: photochemistry

Program A: Thermal effect

Test conditions: 8 hours of exposure, 16 hours of darkness, a total of 24 hours per cycle, three cycles were required, and the total exposure of each cycle was 8.96KWh/m2

Procedure A test precautions:

Instructions: In the test process of program A, the xenon lamp is not lit immediately at the beginning of the test, according to the requirements of the code, it must be lit after 2 hours of the test, closed at 10 hours, and the total irradiation time of a cycle is 8 hours. During the lighting process, the temperature in the furnace rises linearly from 25℃ to 40℃(satisfying most environments in the world) or 55℃(satisfying all environments in the world), and decreases linearly at 10 hours to 25℃ for 4 hours, with a linear slope (RAMP) of 10 hours.

Test procedure B: Degradation effect

Test conditions: Temperature and humidity in the first four hours of the test was (93%), irradiation for 20 hours, darkness for 4 hours, a total of 24 hours per cycle Total exposure for each cycle was 22.4KWh/m2 cycles: 3(3 days: commonly used), 10(10 days), 56(56 days)

Procedure B test precautions:

Instructions: Procedure B test is the only test condition for humidity control during light resistance test in IEC68-2-5 specification. The specification requires that the temperature and humidity conditions are (40±2℃/93±3%) within four hours from the beginning of the test [supplementary description in IEC68-2-9] humidity environment, which should be paid attention to when conducting the test. At the beginning of the program B test, the temperature was raised from 25℃ linear slope (RAMP: 2 hours) to 40℃ or 55℃, maintained for 18 hours, and then the linear cooling (RAMP: 2 hours) returned to 25℃ for 2 hours to complete a cycle of experiments. Remarks: IEC68-2-9 = Solar Radiation Test Guidelines

Test procedure C: Photochemistry (Continuous Irradiation)

Test conditions: 40℃ or 55℃, continuous irradiation (depending on the time required)

Procedure C test precautions:

Note: After the linear temperature rise (RAMP: 2 hours) from 25℃ to 40℃ or 55℃, the continuous irradiation test was carried out at a fixed temperature before the end of the test. The irradiation time was determined according to the characteristics of the product to be tested in the test, which was not clearly specified in the specification.